January 30, 2025 /SemiMedia/ — TSMC is set to commence mass production of its 2-nanometer (nm) process in the second half of this year, with market expectations that production capacity will ramp up swiftly. Monthly output is projected to reach 50,000-60,000 wafers by year-end and could double in 2025, fueling significant growth for key suppliers such as Topco Scientific, Applied Optoelectronics, and Scientech Corporation.

TSMC Chairman Mark Liu previously stated that demand for 2nm chips is exceptionally strong, with the number of tape-outs surpassing that of 3nm. The company is actively expanding capacity to ensure a stable supply for its customers.

According to industry sources, Apple’s M-series chips will be among the first to adopt TSMC’s 2nm process, while AMD’s next-generation CPUs are also expected to leverage the technology. Currently, TSMC has already reached a production volume of around 5,000 wafers at its Baoshan site in Hsinchu. Other major clients, including Nvidia, Qualcomm, and MediaTek, are also expected to transition to 2nm. To support this demand, TSMC has planned the construction of seven fabs for the 2nm node, marking the highest number of facilities dedicated to a single process node in its history.

TSMC’s 2nm manufacturing sites are spread across Hsinchu and Kaohsiung. The F20P1 facility in Baoshan has already begun trial production, while F20P2 is under accelerated construction. In Kaohsiung, the F22P1 fab is progressing ahead of schedule and is expected to enter trial production by the end of the second quarter, with mass production slated for the second half of the year. Meanwhile, construction of the F22P2 and P3 fabs is in full swing. TSMC also plans to submit environmental assessments for P4 and P5 after the Lunar New Year, aiming to break ground within the year.