February 5, 2025 /SemiMedia/ — Infineon announced that its power semiconductor testing team and related automated test equipment technology in Regensburg, Germany, will be acquired by Teradyne. This transaction will provide Infineon with greater flexibility to meet its internal needs for specialized test equipment while ensuring continuity of manufacturing support.

The transfer involves approximately 80 R&D personnel who will join Teradyne’s power semiconductor business unit to advance power semiconductor testing system development. With the evolution of wide-bandgap semiconductor technology, such as gallium nitride (GaN) and silicon carbide (SiC), testing system requirements are constantly changing. GaN devices operate at higher frequencies than traditional silicon-based materials, while SiC devices offer significant advantages in voltage and current handling capabilities, necessitating continuous innovation in testing technology.

Alexander Gorski, Executive Vice President of Frontend Operations at Infineon, stated, “Our collaboration with Teradyne will further enhance our power semiconductor testing capabilities. This integration will not only accelerate innovation but also allow us to scale and adapt more flexibly to the dynamic testing requirements of emerging technologies like SiC and GaN. At the same time, it provides our employees with long-term stable career prospects.”

Teradyne stated that it will fully leverage Infineon’s expertise in power semiconductor testing to strengthen its ETS product portfolio and further solidify its market leadership. Rick Burns, President of Teradyne’s Semiconductor Test Group, commented, “This acquisition and team integration demonstrate our commitment to delivering innovative testing solutions to meet the evolving needs of our customers.”

Through this transaction, Infineon and Teradyne will engage in deeper collaboration in power semiconductor testing technology, driving innovation and development in next-generation semiconductor testing systems.