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South Korea's 2024 chip exports surge 43.9%
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DRAM and NAND flash prices expected to fall sharply in Q1 2025
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TSMC to expand monthly CoWoS capacity to 70,000 wafers in 2025
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Littelfuse completes acquisition of Elmos’ Dortmund wafer fab for €93 million
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Micron to invest $2.17 billion to expand DRAM production in the US
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TAIYO YUDEN launches ultra-thin 0.33 mm metal power inductor
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ROHM Semiconductor and Valeo collaborate on next-generation power electronics for EVs
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Melexis unveils magnetic digital encoder with mounting flexibility
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Infineon accelerates localization in China to address supply chain security concerns
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u-blox release new GNSS chip for wearable applications featuring ultra-low power consumption and high positioning accuracy in the smallest form factor
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